Features:

1) Base material: FR-4, FR-1, FR-2, CEM-1, CEM-3, G-10, base metal laminate 

2) Board thickness: 0.30 - 3.20mm (12 - 26mil) 

3) Copper thickness: 0.50 - 5oz. 

4) Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, 

    UV solder mask 

5) Minimum line width: 0.1mm (4mil) 

6) Minimum line space: 0.1mm (4mil) 

7) Minimum hole diameter: 0.25mm (10mil) 

8) PTH hole diameter tolerance: ±0.076mm (±3 mil) 

9) NPTH hole diameter tolerance: ±0.03mm (±1.2 mil) 

10) Maximum board size: 460 x 620mm (18 x 24) 

11) Board finishing type: hot air leveling, soft gold, har gold, immersion gold, gold

      fingers, carbon ink, cu entek 

12) Outline profile: punching, NC routing, punch and push back 

13 Outline tolerance: ±0.1mm (±4 mil) 

14) Through hole resistance: <300ohms (normal) 

15) Solder mask abrasion: >5H 

16) E-test voltage: maximum 300V 

17) Widely used in telecommunications, computer accessories, vehicle manufacturing 

      and home appliance